IEEE P1386.1 DRAFT 2.2 PCI PDF

Introduction. (This introduction is not part of IEEE Std P, DraftStandard for a Common Mezza- The mezzanine card’s local bus can be PCI, SBus orother local buses as they are developed in the . Relationship Between VME, VME64 and VMEbus. .. Other Host PCB Mechanics. Compatibility – IEEE P PMC module which complies to PCI Local Bus Specification Revision Provides one multifunction interrupt. 5V signaling. Created for compact PCI Mezzanine Card site rack-based system designs, the read-writer’s form factor (PMC) conforms to the PMC IEEE P/Draft

Author: Tecage Duzahn
Country: Croatia
Language: English (Spanish)
Genre: Automotive
Published (Last): 14 January 2004
Pages: 76
PDF File Size: 17.77 Mb
ePub File Size: 4.66 Mb
ISBN: 879-9-53680-361-2
Downloads: 10156
Price: Free* [*Free Regsitration Required]
Uploader: Shaktijind

Basic Dimensions are to be true position within. Usage of these mezzanine cards does not force the host board combined with a mezzanine card to take up p13386.1 slots. Therefore once the host is assembled, there are three critical dimensions that shall be measured to ensure that generic CMCs are in compliance.

This is the P A single mechanical definition builds larger markets with many p1368.1 unique functions being provided for the multitude of user applications, and at a lower price.

This will vary depending on whether a 10 mm or 13 mm spacing is used. The size of these holes depends on how the standoffs are permanently attached to the Pi during assembly. See Figure for a side view of CMC component area. The Multibus I mechanics shall be per Figures and These signals are bussed across all the CMC slots and are driven by the Host module logic.

Care should be taken when installing the boards in systems that have extreme solder-side component heights or in system chassis that do not allow clearances specified in the PICMG or IEEE standards. Note that Multibus I boards do not have front panels. Which of these voltages shall be provided is defined in the specific bus standard: Standoff material is not defined by this specification. Mezzanine Card Mechanics This chapter defines the rraft dimensions for mezzanine cards. Electrical and Logical Layers When a document is more than five years old, and has not been reaffirmed, it is reasonable to conclude that its contents, although still of some value, do not wholly reflect the present state of the art.

  APEX OC4J PDF

The mezzanine card’s local bus can be PCI, SBus or other local buses as they are developed in the future. The mezzanine stand-off shall be an internal part that is permanently attached to the mezzanine card.

Common Mezzanine Card – CMC – PH

References The following publications are used in conjunction with this standard: The second goal of this draft standard is to only have one mezzanine card mechanical definition for a specific type of local bus rather than having multiple mechanical implementations as has happened in the past. If both voltages can be supported, then both holes shall be provided. It is recommended that mezzanine card vendors list the environmental standards, and to which level s that are meet in the product specifications.

The designation of each card size is given in the first column. Due to tolerance build up, this will not perfectly match. Only one change was made to draft 2. This key word is used interchangeably with the phrase “is required”.

“4-Channel High-Speed Serial I/O PMC Adapter”

See Figure 2.22 this dimension. This defines the actual dimensions of a 25 mm metric equipment practice. If the mezzanine card’s local bus operates on the 5V signaling level, it shall provide a 5V ifee hole. If a host computer does not use all of the connectors, this space is open to be utilized by additional components. On side 2 the component height can be up to 3. This section provides information on power sequencing and power requirements by connection phase. The mezzanine card mechanics are defined in chapter 4.

  LM384N DATASHEET PDF

More isolation may be required depending on system requirements. The components on the solder side cover meet the limits of the CPCI specification for maximum height. Defined as some point on a card’s PCB, that is used by the assembly equipment for the reference positioning of a set of components.

In event a different stacking height of 10 or 13 mm is used, the shoulder and host receptacle connector heights shall all be increased by the same height.

PCI Bus, PC CardBus, PCMCIA, Reader Writer, Mezzanine PMC

Since the mezzanine card side 1 faces the host side 1, the power dissipated underneath the mezzanine card should be limited to .22 excessive heat build up in the area between the two.

Copyright c IEEE. Other entities seeking permission to reproduce portions of this document for these or other uses must contact the IEEE Standards Department for the appropriate license. The reason for the extra 1 mm of space is for electrical clearance and air flow.

A P P E N D I X A – Specifications

Recommendations as to which combinations are used are left to the dratf standards that use this standard for their mechanical card definition. See chapter 6 of this standard for o1386.1 signal pin mappings. They are not necessarily members of the Institute. For applications that require more vertical space above the host side 1 surface a 13 mm stacking height is also defined. Excessive build up of solder under the connector contacts will cause the connector to be mounted too high such that when a mezzanine card is plugged into the host’s slot, the plug and receptacle connector seating surface will touch and push against each other with excessive force.

The requirements include the following categories and all associated sections and subcategories:.